Fast, precision-perfect wafering:

Wafering systems from RENA are the first choice when it comes to producing first-class semiconductor wafers, as they are the world market leader in wet chemical production equipment. Engineered for precise process monitoring, high throughput, and flexibility during production, the systems process 200 mm and 300 mm wafers with and without carriers. RENA wafering systems offer maximum production quality and throughput, with the flexibility to be adjusted to customer processes.

Wafering: Wafer fabrication and surface treatment

Semiconductor wafer fabrication requires highly stable systems and consistent processing of the wafer surface. Wafers can be made of monocrystalline silicon, silicon carbide, gallium arsenide, indium phosphide or glass. RENA has various systems for producing wafers from the different materials.

The Acid Etching System (AES) achieves excellent wafer production. This fully automated system meets all requirements for high-end wafer production for wafers up to 300 mm and complies with SEMI standards. Fitted with a quick converter transport system that allows wafers to be changed in the etching bath in under one second, RENA wafering systems really stand out from the crowd in this regard and achieve perfect etch homogeneity. In addition, the half-pitch system ensures the highest throughput rates.

The Polish Cleaning System (PCS) is your best choice in silicon wafer cleaning and ensures a perfect wafer surface. The wet-to-dry cleaning system after polishing specifically removes impurities and foreign particles. The system is suitable for wafers with a diameter of up to 300 mm. On top of that, it does not matter whether it is a full- or half-pitch setup, carrier-less or with carrier processing.

For the final step of fully automated final cleaning, RENA offers the Final Cleaning System (FCS). With the Marangoni dryer, you achieve the perfect final treatment of your semiconductor wafers. Best quality at high throughput!

High flexibility and process control during watering:

The automatic wet processing systems for 200 mm and 300 mm wafers support processing with and without carriers. Precision-perfect process monitoring also allows all the operational and process parameters to be tracked and recorded accurately during production, while the platforms can be flexibly adapted to customer-specific process sequences.

This way, normal- or half-pitch undergo (acid) etching, post-polish cleaning, and final cleaning all in a single production sequence within an optimum production cycle.

Overview of RENA wafering system benefits:

  • Precision-perfect process monitoring for tight process control
  • Flexible adjustment to specific production specifications
  • Full compliance with the SEMI standard
  • Processing with and without carriers
  • High throughput rates
  • Quick converter for changing wafers in the acid etcher in under one second
  • Flexible input and output solutions (FOUP, SMIF, stockers, OHT, AGV)