Flip Chip & Die Bonder For Solder Attach & Thermo Compression Bonding

AT-DB Flip Chip Die Bonders For Engineering & Assembly

Advanced Technologies US Inc. (ATCO) offers the latest AT-DB Flip Chip and Die Bonder for precision based assembly utilizing advanced software for seamless thermal compression and solder attachment. Dedicated to providing the best die bonders for engineering applications in the industry, all of our products undergo rigorous research and development, including a 5-year warranty on parts and labor, and come complete with the best installation, repair, and calibration services in the industry