High Precision and High Speed Offline AOI

Intelligent Programming Flow

■ Auto-generated on the solder pad window based on bare board

■ CAD assignment to generate on the component Window

Advanced Hardware Architecture

■ Granite Platform and Frame

Ensure the stability of the equipment and the consistency of sharing program between machines.

■ Industrial Camera + Telecentric Lens

The high component solder joint inspection is not affected as no shadow effect in the entire filed of view.

Core Technology and Advantages

■ Intelligent Solder pad positioning + Entire FOV Assist Positioning

• Solder pad position able to reduce high false call due to deformation of PCB after reflow, especially for FPC.
• For non FPC, entire FOV assist positioning is the perfect solution to reduce the high false call due to PCB warp, silkscreen,

interference of the board’s legend.

• High detection ability on no exposed pad components (BGA,etc.) or partially shielded components.

■ Poor Soldering Inspection

Based on precisely positioning on the solder pad, the features points of the entire solder pad will be analyzed. Therefore,

the poor solder of chip or IC can be effectively detected.

■ Detection Parameters Directly Interface with IPC Standards

Based on the IPC test standard, the test results are more reliable. Shift: IPC-A-610-G Class 3 – If the component shift out of

solder pad more than 25% of the component electrode, it will be NG.

■ Other Advantages

Intelligent programming (One click rectification, Add substitute, Sub-programming ,etc.); Offline programming and fine

tuning in real time without stopping the production line; Special wave soldering algorithm for DIP inspection; Remote