Automatic Wafer Lamination System:

The ATM-3000EF is the ideal system for laminating tape to wafers, for the back grind process and dry resist film lamination process.

Features:

• State-of-the-art design to maintain the integrity of the lamination area and to achieve the best footprint.
• Ergonomic design for optimum access to operator areas and service areas on the system
• Tape stretch data control.
• Ease of operation
• FOUP option
• AGV and OHT protocol option
• Applicable to 8″ and 12″ dia-wafer
• Heater roller and heater table are applicable