Wafer BG Tape Lamination Machine
Automatic Wafer Lamination System:
The ATM-3000EF is the ideal system for laminating tape to wafers, for the back grind process and dry resist film lamination process.
- State-of-the-art design to maintain the integrity of the lamination area and to achieve the best footprint.
- Ergonomic design for optimum access to operator areas and service areas on the system
- Tape stretch data control.
- Ease of operation
- FOUP option
- AGV and OHT protocol option
- Applicable to 8″ and 12″ dia-wafer
- Heater roller and heater table are applicable