Wafer BG Tape Lamination Machine

Automatic Wafer Lamination System:

The ATM-3000EF is the ideal system for laminating tape to wafers, for the back grind process and dry resist film lamination process.


  • State-of-the-art design to maintain the integrity of the lamination area and to achieve the best footprint.
  • Ergonomic design for optimum access to operator areas and service areas on the system
  • Tape stretch data control.
  • Ease of operation
  • FOUP option
  • AGV and OHT protocol option
  • Applicable to 8″ and 12″ dia-wafer
  • Heater roller and heater table are applicable