Inverted Camera Inline AOI

■ Intelligent Solder pad positioning + Entire FOV Assist Positioning

• Solder pad positionable to reduce high false call due to deformation of PCB after reflow, especially for FPC.
• For non FPC, entire FOV assist positioning is the perfect solution to reduce the high false call due to PCB warp, silkscreen, interference of the board’s legend.
• High detection ability on no exposed pad components (BGA, etc.) or partially shielded components.

■ Poor Soldering Inspection

Based on precisely positioning on the solder pad, the features points of the entire solder pad will be analyzed. Therefore, the poor solder of chip or IC can be effectively detected.

■ Detection Parameters Directly Interface with IPC Standards.

Based on the IPC test standard, the test results are more reliable. Shift: IPC-A-610-D Class 3 – If the component shifts out of solder pad more than 25% of the component electrode, it will be NG.

■ Special Wave Soldering Algorithm for DIP Inspection

Special wave soldering algorithm on hand insert and machine insert DIP inspection.

■ Unmanned Smart Factory Solution

Data communication with upstream and downstream equipment (OK/NG magazine, NG Buffer and OK/NG magazine loader).

■ Other Advantages

Intelligent programming (One-click rectification, Add substitute, Sub-programming, etc.); Offline programming and fine-tuning in real-time without stopping the production line; Remote technical support.