Wafer Cleaning Equipment:

The main function of this equipment is to carry out the basketless cleaning process for traditional mortar cutting and diamond wire cutting silicon wafers.

Cleaning silicon wafer: 166*166mm

• Maximum throughput per batch: 480 tablets
• Beat: 160-300 seconds (user can design)
• Film box: 120 pieces, 4 boxes per slot
•  Handling maximum weight: 80kg