Wafer Slicing

Diamond wire multi-wire wafer slicing machine 

Features:

  1. The equipment base and spindle box support are integrative cast structure.
  2. The main shaft adopts angular bearing and oil & gas lubrication structure, which is suitable for high speed and long life cutting with thin wire.
  3. The lightweight idle wheel with low inertia, easy to replace the assembly structure.
  4. It is patient using mechanical disc spring for silicon-tray clamping.
  5. Siemens or Rexroth motion control system and original motor.
  6. The vertical feed adopts the casting with 4 guideway mechanism to reduce the cutting TTV.
  7. The utility model adopts a patented device for the alarm of broken wire thin wire with eccentric block issuing mechanism.
  8. The retraceable wire system is located on both sides of the equipment and is mounted directly on the casting base.
  9. The tension arm weight and the suspension length are small, the line arrangement angle is close to 90 degree which is easy to control
  10. The automatic matching design can realise the automatic cleaning of a single machine, one-key loading, one-key automatic tool-setting and easy connection setting.
  11. The surface quality of silicon wafers such as TTV, line marks, edge-breaking extra cutting and wire-breaking are well controlled.