Diamond wire multi-wire wafer slicing machine
- The equipment base and spindle box support are integrative cast structure.
- The main shaft adopts angular bearing and oil & gas lubrication structure, which is suitable for high speed and long life cutting with thin wire.
- The lightweight idle wheel with low inertia, easy to replace the assembly structure.
- It is patient using mechanical disc spring for silicon-tray clamping.
- Siemens or Rexroth motion control system and original motor.
- The vertical feed adopts the casting with 4 guideway mechanism to reduce the cutting TTV.
- The utility model adopts a patented device for the alarm of broken wire thin wire with eccentric block issuing mechanism.
- The retraceable wire system is located on both sides of the equipment and is mounted directly on the casting base.
- The tension arm weight and the suspension length are small, the line arrangement angle is close to 90 degree which is easy to control
- The automatic matching design can realise the automatic cleaning of a single machine, one-key loading, one-key automatic tool-setting and easy connection setting.
- The surface quality of silicon wafers such as TTV, line marks, edge-breaking extra cutting and wire-breaking are well controlled.