V5000 Series

High Precision and High Speed Inline AOI

Advanced Hardware Architecture

■ Granite Platform and Frame

Ensure the stability of the equipment and the

consistency of sharing program between machines.

■ Industrial Camera + Telecentric Lens

The high component solder joint inspection is not

affected as no shadow effect in the entire filed of view.

Core Technology and Advantages

■ Intelligent Solder pad positioning + Entire FOV Assist Positioning

• Solder pad position able to reduce high false call due to deformation of PCB after reflow, especially for FPC.
• For non FPC, entire FOV assist positioning is the perfect solution to reduce the high false call due to PCB warp, silkscreen, interference of the board’s legend.
• High detection ability on no exposed pad components (BGA,etc.) or partially shielded components.

■ Poor Soldering Inspection

Based on precisely positioning on the solder pad, the features points of the entire solder pad will be analyzed. Therefore, the poor solder of chip or IC can be effectively detected.

Core Technology and Advantages

■ Detection Parameters Directly Interface with IPC Standards

Based on the IPC test standard, the test results are more reliable. Shift: IPC-A-610-G Class 3 – If the component shift out of solder pad more than 25% of the component electrode, it will be NG.

■ High Inspection Ability for Laser Body Marking The laser barcode and laser body marking are difficult to differentiate by RGB light source due to background noise. MagicRay using unique design light source which is helpful to inspect the laser barcode and laser body marking.

■ Un-Populated and Solder Ball Inspection

This function can be turned on at any time.

■ Unmanned Smart Factory Solution

Data communication with upstream and downstream equipment (OK/NG magazine, NG Buffer and OK/NG magazine loader).