VSP3000 Solder Paste Inspection
■ For solder paste inspection after SMT printing
■ Automatic zero reference technology can meet the inspection requirements of PCB in different colors
■ Granite platform + Casting crossbeam, ensuring high stability
■ The combination of 3D and R/G/B can effectively detect for the bridge of the fine solder paste
■ Adopting the algorithm of maximum cross section enclosed to effectively detect the bad situation of broken solder
■ Complete SPC function can meet the data statistics and quality analysis requirements for production line.
Optical Imaging Principle
■ By means of phase shift projection, the information of the height of the object with diffuse reflection can be well restored.
Core Technology and Advantages
■ Easy and Fast Programming
Programming wizard makes it easy to operate and quick to get started.
■ Automatic Zero Reference Point Technology
The zero reference point is generated automatically which able to shorten the programming time.
■ Cross Section Analysis Function
Contribute flexibly to analysis the shape of solder paste.
■ Detection for Broken Solder Adopting the algorithm of maximum cross section
enclosed to effectively detect the bad situation of broken solder.
■ Color Filtration Technology
Can effectively overcome the”icicle”phenomenon caused by zero reference misalignment and solder paste overflow after the PCB warpage.