Product Features

■ For solder paste inspection after SMT printing

■ Automatic zero reference technology can meet the inspection requirements of PCB in different colors

■ Granite platform + Casting crossbeam, ensuring high stability

■ The combination of 3D and R/G/B can effectively detect for the bridge of the fine solder paste

■ Adopting the algorithm of maximum cross section enclosed to effectively detect the bad situation of broken solder

■ Complete SPC function can meet the data statistics and quality analysis requirements for production line.

Optical Imaging Principle

■ By means of phase shift projection, the information of the height of the object with diffuse reflection can be well restored.

Core Technology and Advantages

■ Easy and Fast Programming

Programming wizard makes it easy to operate and quick to get started.

■ Automatic Zero Reference Point Technology

The zero reference point is generated automatically which able to shorten the programming time.

■ Cross Section Analysis Function

Contribute flexibly to analysis the shape of solder paste.

■ Detection for Broken Solder Adopting the algorithm of maximum cross section

enclosed to effectively detect the bad situation of broken solder.

■ Color Filtration Technology

Can effectively overcome the”icicle”phenomenon caused by zero reference misalignment and solder paste overflow after the PCB warpage.